• Semiconductors & Devices

FOR IMMEDIATE RELEASE No. 3749

Rendition of planned facility

Rendition of planned facility

TOKYO, November 20, 2024 - Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will invest approximately 10 billion yen to construct a new facility for the assembly and inspection of power semiconductor modules at its Power Device Works in Fukuoka Prefecture, Japan. The plant, which was originally announced on March 14, 2023, is scheduled to begin operations in October 2026.
As the primary facility for assembling and inspecting power semiconductor modules, the plant will consolidate previously dispersed assembly and inspection production lines within the site to streamline production, from the incoming of components through manufacturing and final shipment. New systems will be implemented to automate the management of manufacturing processes and the transportation of products for improved productivity. In addition, the company's integrated system covering everything from design, development and production technology verification to manufacturing will be strengthened to enhance product development.
Mitsubishi Electric expects the new plant to support its rapid and stable supply of products to meet market needs in response to the anticipated increases in demand for power semiconductors. As a result, the company envisions contributing to the energy efficiency of power-electronics devices in various applications, as well as the Green Transformation (GX).
In connection with the construction of the new plant, Fukuoka Prefecture has designated Mitsubishi Electric for the second time as a corporate entity of the Green Asia International Strategic Comprehensive Special Zone. By utilizing the preferential incentives of this special zone, Mitsubishi Electric will be able to strengthen the production capabilities of its Power Device Works' new plant in Fukuoka Prefecture.

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