• Research & Development

FOR IMMEDIATE RELEASE No. 3322

TOKYO, December 10, 2019 - Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has received an R&D 100 Award for an innovative one-piece-flow automatic-sliding plating machine that enables plating plants to achieve improved productivity and reduced environmental load. The award was received during the R&D 100 Awards ceremony, which took place in San Francisco, USA on December 5. To date, Mitsubishi Electric has received 26 R&D 100 Awards from R&D World.

Electroplating is a process that puts the target item into contact with a plating solution via an electrode, without requiring a plating bath, enabling just the contact surface to be plated while sliding by the electrode.

  • R&D 100 Awards ceremony participants

    R&D 100 Awards ceremony participants

  • One-piece-flow automatic-sliding plating machine

    One-piece-flow automatic-sliding plating machine

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  • R&D 100 Awards ceremony participants
  • One-piece-flow automatic-sliding plating machine

Features of Award-winning Technology and Equipment

  1. 1) Deploys high-speed plating technology for improved productivity
    • Liquid resistance is reduced by greatly shortening the distance between electrodes during plating.
    • Reduced liquid resistance enables use of high current for faster film formation.
    • High-speed film formation shortens process time for continuous one-piece-flow plating without reducing processing volume, realized improved automation with a downsized machine.
    • Compared with conventional batch-processing method for high-volume plating, processing time per unit is reduced to about one-fifth, just 45 seconds per piece, compared to 215 seconds using conventional plating processes at certain Mitsubishi Electric factories.
  2. 2)Reduces environmental load through high-efficiency, high-quality sliding plating technology
    • Highly efficient sliding plating technology reduces plating solution to one-tenth that of current process and low-loss solution-circulation system greatly reduces amount of wasted solution.
    • Optimizes amount of plating solution by accurately controlling both solution supplied to electrode and spreading speed, and by improving plating film quality.

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