T/T1 series equipped with seventh generation IGBT
Insulated gate bipolar transistor (IGBT) modules, which are indispensable devices for inverters in all kinds of industrial equipment, have been improved with higher current and higher withstand voltage since their commercialization in 1990. In addition, Mitsubishi Electric has responded to the need for lower loss and downsizing of industrial equipment by moving from a flat planar chip structure to a trench gate structure, and by using CSTBT™ (Mitsubishi Electric's unique IGBT that makes use of the carrier cumulative effect). The T/T1 series is smaller and has lower power dissipation than the conventional S series (6th generation IGBTs). Furthermore, the NX and LV100 types have been added to the standard (std) type of conventional external shape.
Features
- New lineup of products with built-in 3-phase converter, inverter, and brake circuit (CIB) contributes to simplification of industrial equipment design
- Reduced external size by approx. 36% compared to conventional products, contributing to miniaturization of industrial equipment (CIB)
- Equipped with a 7th generation IGBT adopting a CSTBT™*1 configuration and a diode adopting an RFC *2 configuration, this product reduces power loss and contributes to lower power consumption of industrial equipment
- A new structure reduces the soldered portion and improves thermal cycle life to contribute to higher reliability of industrial equipment
- Simplifies the assembly process of industrial equipment by adopting press-fit terminals and PC-TIM*3.
- ※1：Mitsubishi Electric's unique IGBT that makes use of the carrier cumulative effect
- ※2：Relaxed Field of cathode
- ※3：Phase Change-thermal Interface Material
Applications
- Motion control
- Renewable energy
- Power supply, Uninterruptable power supply (UPS)
Higher reliability through adoption of a new structure (improved thermal cycle life)
Lineup
| IC (A) | Connection | Type name | |||||
|---|---|---|---|---|---|---|---|
| VCES=650V | VCES=1200V | VCES=1700V | |||||
| Pin | Pressfit | Pin | Pressfit | Pin | Pressfit | ||
| 35 | - | - | - | - | |||
| 50 | - | - | |||||
| 75 | - | - | |||||
| - | - | ||||||
| 100 | |||||||
| - | - | - | - | ||||
| - | - | ||||||
| 150 | |||||||
| - | - | ||||||
| 200 | - | - | |||||
| - | - | ||||||
| 225 | - | - | |||||
| 300 | |||||||
| 450 | |||||||
| 600 | |||||||
| 800 | - | - | - | - | |||
| 1000 | - | - | - | - | |||
| Package |  *Images are for illustrative purposes only. External dimensions vary depending on the specific model. | ||||||
Documents
Corresponding Products
IGBT modules LV100 type
A highly-versatile common external dimension package used in a wide range of railway and power applications, achieving a current density of 17.14 A/cm2, the highest in the industry*1. *1. As of August 25, 2020. According to Mitsubishi Electric’s study.
IGBT modules std type
A lineup comprising three package types with 2in1 circuit configurations.
Links to associated page
Power loss simulator
Simplified simulator to calculate power module losses and temperature rise.
FAQ