J1 Series
Automotive Direct Cooling Power Module
Extra-compact, direct-cooling 6-in-1 package with cooling fin.
Inverter power-loss reduction and high reliability supported by 7th-generation IGBT chip applied CSTBTTM※1 technology.
※1：CSTBTTM is Mitsubishi Electric’s original IGBT chip construction incorporating carrier-store effect.
Features
- Low power loss 7th-generation IGBT chip applied CSTBTTM technology.
- High reliability DLB※2 structure
- 6-switching elements per package (6-in-1, insulated type)
Direct cooling package with cooling fin - Compact, light-weight, high-power-density module
- Built-in on-chip temperature sensor
- Built-in on-chip current sensor for SC protection
- ※2：Direct Lead Bonding
Applications
- EV・HEV
- High reliability inverter
Lineup
| VCES (V) | IC (A) | Type Name |
|---|---|---|
| 650 | 600 | |
| 650* | 700 |
700A product has an optional specification with an insert nut embedded in the board mounting boss.
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Power Loss Simulation Software
Calculate average power loss and temperature rise for Mitsubishi Electric power modules.
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