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FOR IMMEDIATE RELEASE No. 2933

Mitsubishi Electric to Ship Samples of New IGBT Module T Series with Seventh-generation IGBT

Expanded lineup will contribute to low power loss and high reliability of industrial equipment

TOKYO, May 19, 2015- Mitsubishi Electric Corporation announced today that it would begin shipping samples of its new T series power semiconductor modules featuring seventh-generation insulated-gate bipolar transistors (IGBTs), comprising three different packages and 48 models in total. The new modules realize improved power loss and reliability for general-purpose inverters, elevators, uninterruptible power supplies (UPS) and other industrial equipment. Sample shipments will begin June 30.

The modules will be exhibited at major trade shows including Power Conversion Intelligent Motion (PCIM) Europe 2015 in Nuremberg, Germany from May 19 to 21, MOTORTECH JAPAN 2015 during TECHNO-FRONTIER 2015 in Japan from May 20 to 22, and PCIM Asia 2015 in China from June 24 to 26.

NX-type Solder Pin Package
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NX-type Solder Pin Package

NX-type Press Fit Pin Package
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NX-type Press Fit Pin Package

Standard-type Package
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Standard-type Package

Product Features
1) Reduced power loss thanks to seventh-generation IGBT and seventh-generation diode
-Seventh-generation CSTBT1TMchip achieves low power loss and low EMI noise.
-Relaxed Field of Cathode (RFC) diode2 chip incorporating new backside diffusion process achieves low power loss and suppression of recovery-voltage surge.
1 Mitsubishi Electric's original IGBT chip construction incorporating carrier-store effect
2 P layer is added partially on cathode side and the hole is injected during recovery term to soften the recovery waveform and to suppress the surge voltage (only for 1200V rating).
2) Reliability of de facto standard package are improved by latest package technology
-The internal structure is improved, keeping compatibility with de facto standard package.
-Integration of insulation and copper base in the substrate, along with improved internal electrode construction, helps to increase thermal cycle life3 and lower internal inductance, leading to more reliable equipment performance.
3 The life proven in a stress test of relatively long-term temperature cycling between two case temperature
Sample Shipments
Package Voltage Rating Current Rating Shipment
NX-type
Solder Pin Package		 650V 100, 150, 200, 300, 450, 600A From June 30
1200V 100, 150, 200, 225, 300, 450, 600, 1000A
NX-type
Press Fit Pin Package		 650V 100, 150, 200, 300, 450, 600A
1200V 100, 150, 200, 225, 300, 450, 600, 1000A
Standard-type
Package		 650V 100, 150, 200, 300, 400, 600A
1200V 100, 150, 200, 300, 450, 600A

Inquiry

Media Contact
Public Relations Division
Mitsubishi Electric Corporation
Customer Inquiries
Power Device Overseas Marketing Dept.A and Dept.B
Mitsubishi Electric Corporation
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