Power Devices > Applications > Motion Control

Motion Control

IGBT and IPM modules are indispensable devices for industrial inverter and servo drive applications.

Features of Mitsubishi Electric power modules for motion control
  • CSTBT™*1 chips
  • Low power losses and low thermal impedance
  • Improved dv/dt controllability by gate resistance (Seventh Generation IGBT modules)
  • PC-TIM*2 preapplied thermal interface material (Option for Seventh Generation IGBT modules)
    • *1 : CSTBT is Mitsubishi Electric’s original IGBT chip construction incorporating carrier-store effect.
    *2 : Phase Change Thermal Interface Material
System Block Diagram
■2-level inverter
■I-type multi-level (3-level) inverter
■T-type multi-level (3-level) inverter
Power Module Map

Click series titles for more information.

Note) HVIC: High Voltage IC to drive power MOSFET and IGBT module
   Current range of power devices driven by HVICs

Note) HVIC: High Voltage IC to drive power MOSFET and IGBT module
   Current range of power devices driven by HVICs

*1 Not recommended for new designs

*1 Not recommended for new designs
▶ 100V Nominal MOSFET module