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FOR IMMEDIATE RELEASE No. 2736
Mitsubishi Electric to Launch MOSFET-type Super-mini DIPIPM
Contributes to reduced power consumption, miniaturization and lower cost of small-capacity motors for refrigerators, other products
TOKYO, February 18, 2013 - Mitsubishi Electric Corporation (TOKYO: 6503) announced today it will launch a transfer-mold-type, super-mini dual inline package intelligent power module (DIPIPM) primarily used for inverter drive systems of small-capacity motors in refrigerators and other consumer appliances. The module uses a metal oxide semiconductor field effect transistor (MOSFET) switching device featuring low power-on voltage in low current regions. Sales will begin on March 1.
With optimized low-loss-drive ICs and a high-heat dissipation design, the module will help to reduce power consumption, advance miniaturization and lower the cost of inverter systems for small-capacity motor drive applications.
With optimized low-loss-drive ICs and a high-heat dissipation design, the module will help to reduce power consumption, advance miniaturization and lower the cost of inverter systems for small-capacity motor drive applications.
Product Features
Sale Schedule
Main Specifications
In 1997, Mitsubishi Electric first commercialized its DIPIPM transfer-mold-type intelligent power module, which has contributed greatly to miniaturization and energy-savings in inverter systems. The technology has gained increased importance because annual power consumption has become an important index of energy-saving performance in consumer appliances, such as refrigerators. Needs are increasing for reducing loss in rated power, and also in low current regions where a high percentage of power use is concentrated.
DIPIPM is a registered trademark of Mitsubishi Electric.
Reduced power consumption in small-capacity inverter systems
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High reliability through high-heat dissipation structure
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Cost reduction and miniaturization of final product
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Sale Schedule
Model | Specification | Shipment date |
PSM03S93E5/-A/-C | 3A/500V | March 1, 2013 |
PSM05S93E5/-A/-C | 5A/500V |
Main Specifications
Model | PSM03S93E5/-A/-C | PSM05S93E5/-A/-C |
Specification | 3A/500V | 5A/500V |
Dimensions | 24 x 38 x 3.5 mm (same as super-mini DIPIPM) | |
Built-in Chips | MOSFET x 6 forming a three-phase bridge, HVIC x 1, LVIC x 1and Bootstrap Diode x 3 |
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Functions | Protection against short circuits, control power-supply undervoltage and over-heating (LVIC monitoring ); and error output |
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Others | Divided-source-type N-side MOSFET |
In 1997, Mitsubishi Electric first commercialized its DIPIPM transfer-mold-type intelligent power module, which has contributed greatly to miniaturization and energy-savings in inverter systems. The technology has gained increased importance because annual power consumption has become an important index of energy-saving performance in consumer appliances, such as refrigerators. Needs are increasing for reducing loss in rated power, and also in low current regions where a high percentage of power use is concentrated.
DIPIPM is a registered trademark of Mitsubishi Electric.