Mitsubishi Electric ADVANCE
Publication Date | Title | |
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Sep. 2022 | Overview | |
SiC Power Module for Automotive | ||
TH-Series: 7th Generation IGBT Modules for High-frequency Switching in Industrial Operation | ||
The Investigation of Humidity Absorption Behavior of Silicone Gel in HVIGBT Modules | ||
Built-in BSD-Function 600V High Voltage Integrated Circuit "M81777FP" | ||
Development of SiC Trench MOSFET with Novel Structure Enabling Lower Losses | ||
Dec. 2020 | Overview | |
Development of SiC-MOSFET Chip Technology | ||
Development of Wiring Technologes to Improve Power Module Performance | ||
2000 V Class IGBT Concept for Renewable Energy Converter | ||
Humidity Robustness Verification Test for HVIGBT Modules | ||
Development of Surface-mount IPM | ||
Mar. 2019 | Overview | |
RC-IGBT Chip Technology for White Goods | ||
Development of Package Structure for High-Temperature Operation | ||
Packaging Technologies Using Epoxy Resin Sealing | ||
Relaxing Thermal Stress by Using SLC Technology and New PC-TIM | ||
Optimized inverter design by DIPIPM+ | ||
Sep. 2016 | Overview | |
7th Generation Power Chip Technologies for Industrial Application | ||
Packaging Technology for Highly Reliable Industrial Power Modules | ||
7th Generation IGBT Module "T Series" for Industrial Applications | ||
7th Generation IPM "G1 Series" for Industrial Applications | ||
All-in-One Type DIPIPM with Built-In Converter, Inveter and Brake | ||
Mar. 2015 | Overview | |
Super Mini DIPIPM "Ver.6 Series | ||
Hybrid SiC Modules for High-Frequency Applications | ||
Next-Generation Power Module for Automotive Applications - J1-Series | ||
Low On-Resistance SiC-MOSFET with a 3.3-kV Blocking Voltage | ||
Packaging Technologies for High-Temperature Power Semiconductor Modules | ||
Sep. 2013 | Overview | |
Development of SiC Power Devices – Present Status | ||
1.7kV Hybrid SiC Power Module with Large Current Capacity and Low Power Loss | ||
1,200 V HVIC Technology for Power Inverter System | ||
1200V/50A Large DIPIPM Ver. 4 | ||
The IGBT Module for Three-Level Bidirectional Switch Type Inverter | ||
J-Series" IPM and T-PM for EV and HEV Applications |
Bodo's Power Systems (英文)
Publication Date | Title | |
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Sep. 2023 | The DIPIPM Family: Our Technology, Your Comfort | |
Jul. 2023 | Increasing Power Density of 4.5 kV IGBT Power Modules | |
Feb.2023 | Parallel Operation: Influence of Power Module Parameters | |
Sep. 2022 | LV100 IGBT Modules for Best Performance in Renewable and Industrial Applications | |
Sep. 2021 | High-Voltage IGBT Modules for High-Power High-Reliability Applications | |
Jul. 2021 | Demands by Future Railway Converters and How They Change Power Semiconductor Modules | |
Apr. 2021 | Small Power IPM for High Integration Demand | |
Dec. 2020 | Towards a Greener Future: Highly Efficient SiC Power Devices for Wide Application Range | |
Oct. 2020 | LV100: Smart Solution for 1500VDC 3-Level Central PV Inverters | |
May. 2020 | X-Series RFC Diodes for Robust and Reliable Medium-Voltage Drives | |
Apr. 2020 | An Intelligent Power Module for High Switching Speeds | |
Nov. 2019 | Robust High Voltage IGBT Power Modules Against Humidity and Condensation | |
Oct. 2019 | The Intelligent Power Module Concept for Motor Drive Inverters | |
May. 2019 | The Next Generation of High Power IGBT Modules | |
Feb. 2019 | Switching Performance of 750A/3300V Dual SiC-Modules | |
Jan. 2019 | 1700V X-Series HVIGBT Power Modules with Excellent Performance and Reliability | |
Dec. 2018 | 7th Generation NX type (NX7) Converter Inverter Brake (CIB) Modules | |
Sep. 2018 | Gaining Speed: Mitsubishi Electric SiC-Power Modules | |
Jun. 2018 | New Transfer Molded SMD Type IPM | |
Mar. 2018 | 7th Generation 1700 V IGBT Modules: Loss Reduction and Excellent System Performance | |
Jan. 2018 | 3.3 kV Full SiC MOSFETs – Towards High-Performance Traction Inverters | |
Dec. 2017 | High Power Density,High Performance X-Series 4500V IGBT Power Modules | |
Oct. 2017 | Advanced Si-IGBT Chip Design for Maximum Overall System Performance | |
May. 2017 | New Horizons in Thermal Cycling Capability Realized with the 7th gen. IGBT Module | |
Nov. 2016 | Innovative 7in1 IGBT Packages for Scalable and Easy Design of Industrial Drives and Inverters | |
Sep. 2016 | All-In-One DIPIPM+ Series for Compact Inverter Designs | |
Apr. 2016 | Power Modules for Combining Innovation Flexibility and Power Capability in the Various 3-Level Topologies | |
Jan. 2016 | Transfer Mold IPM Family “SLIMDIP” with 5A/15A 600V RC (Reverse Conducting)– IGBT in a Compact Package | |
Oct. 2015 | Highest Power Density by 7th Gen. IGBT Std-Type Module with New TMS-Technology | |
Jun. 2015 | 7th Gen. IGBT and Diode Chipset Enabling Highest Performance Power Modules | |
Feb. 2015 | 4in1 400A/1200V Module with T-type Topology for 3-Level Applications |